SCHMID's Silver-Free Backside affords great Cost Reductions for Mass Production
Industrial application of the SCHOTT patented system saves 6 US cent/wafer and increases efficiency by 0.2%. Problem-free integration in cell or module production lines Sales launch: May 2012
Abbildung 1: Silver-free backside with all-over aluminum backside and three tin busbars
The SCHMID Group announces their sales launch of a production-ready system for the
industrial application of tin busbars on 6" cells. Delivery of the first TinPad systems is
planned for September.
Silver is a critical cost factor in cell production. Tests to replace this material on the
backside by tin which is comparatively much cheaper, have up till now been
unsuccessful due to its insufficient adhesion to aluminum. Using the SCHOTT patented
technology it is now possible to produce completely silver-free backside contacts with a
peel-off strength which is twice as high as required. By using tin instead of the
conventional silver/aluminum paste, savings of 6 US cent per wafer are achieved,
which makes amortization of the investment possible in 7-9 months.
At the same time this new backside architecture increases the cell efficiency by approx.
0.2%, because openings of the aluminum backside are no longer required for the Follow us on Page 2
busbars. The all-over back surface field thus increases the open circuit voltage which in
turn boosts efficiency.
The first version of the TinPad system realizes a throughput of up to 2,880 wafers with
an uptime of over 95% and is easy to integrate in existing cell production lines. Module
manufacturers can also use this technology and thus increase their value chain.
About the SCHMID Group
The SCHMID Group provides highly efficient system and process solutions for the
entire solar wafers, cells and modules supply chain. Starting with the single machine
right up to the turnkey factory, including guaranteed performance parameters, such as
production capacity and degree of efficiency. Innovative process technologies are
developed at their own technology centers in partnership with universities and research
facilities and are made ready for the market.
SCHMID welcomes you to the SNEC: 16th- 18th May 2012 in the E5 halls, Stand 560.
Further Information for Press Representatives
SCHMID will provide detailed information on the tin pad system at the IPVEA press
conference during the SNEC in Shanghai: Wednesday, May 16 2012 at 14 h in the
Kerry Hotel Pudong, Function Room 1, 1388 Hua Mu Road, Pudong, Shanghai 201204,
China.
The tin pad system has been nominated for the Intersolar Award in the category
of PV production technologies.
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Press Contact
SCHMID Group | Gebr. SCHMID GmbH
Magdalena Harter (Corporate News)
Christoph Kübler (Technology)
Robert-Bosch-Str. 32-36
72250 Freudenstadt
Germany
Tel.: +49 7441 538 0
www.schmid-group.com
press@schmid-group.com
