SCHMID's Silver-Free Backside affords great Cost Reductions for Mass Production
Industrial application of the SCHOTT patented system saves 6 US cent/wafer and increases efficiency by 0.2%. Problem-free integration in cell or module production lines Sales launch: May 2012
Abbildung 1: Silver-free backside with all-over aluminum backside and three tin busbars
The SCHMID Group announces their sales launch of a production-ready system for the
industrial application of tin busbars on 6" cells. Delivery of the first TinPad systems is
planned for September.
Silver is a critical cost factor in cell production. Tests to replace this material on the backside by tin which is comparatively much cheaper, have up till now been unsuccessful due to its insufficient adhesion to aluminum. Using the SCHOTT patented technology it is now possible to produce completely silver-free backside contacts with a peel-off strength which is twice as high as required. By using tin instead of the conventional silver/aluminum paste, savings of 6 US cent per wafer are achieved, which makes amortization of the investment possible in 7-9 months.
At the same time this new backside architecture increases the cell efficiency by approx. 0.2%, because openings of the aluminum backside are no longer required for the Follow us on Page 2 busbars. The all-over back surface field thus increases the open circuit voltage which in turn boosts efficiency.
The first version of the TinPad system realizes a throughput of up to 2,880 wafers with an uptime of over 95% and is easy to integrate in existing cell production lines. Module manufacturers can also use this technology and thus increase their value chain.
About the SCHMID Group
The SCHMID Group provides highly efficient system and process solutions for the entire solar wafers, cells and modules supply chain. Starting with the single machine right up to the turnkey factory, including guaranteed performance parameters, such as production capacity and degree of efficiency. Innovative process technologies are developed at their own technology centers in partnership with universities and research facilities and are made ready for the market.
SCHMID welcomes you to the SNEC: 16th- 18th May 2012 in the E5 halls, Stand 560. Further Information for Press Representatives SCHMID will provide detailed information on the tin pad system at the IPVEA press conference during the SNEC in Shanghai: Wednesday, May 16 2012 at 14 h in the Kerry Hotel Pudong, Function Room 1, 1388 Hua Mu Road, Pudong, Shanghai 201204, China.
The tin pad system has been nominated for the Intersolar Award in the category of PV production technologies.
Characters of main text (including spaces): 1663
SCHMID Group | Gebr. SCHMID GmbH
Magdalena Harter (Corporate News)
Christoph Kübler (Technology)
Tel.: +49 7441 538 0